Soundstrate®
Employing patented printed circuit board (PCB) and wafer-silicon technology, Soundstrate supports the deployment of complex system-level audio solutions in the smallest possible form-factors.
Soundstrate serves as an electroacoustic module, integrating active electronics, acoustic waveguides, filters and transducers within the substrate of a PCB assembly or silicon wafer. In doing so, Soundstrate simplifies the assembly and manufacturing of complex, miniature audio devices by eliminating bulky audio waveguides and cabling.
Features
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01
Compact, multi-purpose structure providing acoustic, electronic and mechanical functionality
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02
Producible via modified PCB or silicon-wafer technology
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03
Supports integration of active electronics, acoustic waveguides, acoustic filters and MEMS transducers
Benefits
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01
Reduces the size, part count and complexity of smart, wearable in-ear devices
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02
Simplifies the co-location of transducers and processing elements within a compact space
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03
Increases product reliability by eliminating hand-assembled cabling
