Soundstrate®

Employing patented printed circuit board (PCB) and wafer-silicon technology, Soundstrate supports the deployment of complex system-level audio solutions in the smallest possible form-factors.

Soundstrate serves as an electroacoustic module, integrating active electronics, acoustic waveguides, filters and transducers within the substrate of a PCB assembly or silicon wafer. In doing so, Soundstrate simplifies the assembly and manufacturing of complex, miniature audio devices by eliminating bulky audio waveguides and cabling.

Features
  • 01

    Compact, multi-purpose structure providing acoustic, electronic and mechanical functionality

  • 02

    Producible via modified PCB or silicon-wafer technology

  • 03

    Supports integration of active electronics, acoustic waveguides, acoustic filters and MEMS transducers

Benefits
  • 01

    Reduces the size, part count and complexity of smart, wearable in-ear devices

  • 02

    Simplifies the co-location of transducers and processing elements within a compact space

  • 03

    Increases product reliability by eliminating hand-assembled cabling