DSP Group, Inc.

DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipsets for the mobile, converged communications and hearables markets. Leveraging its rich experience in wireless and voice technology, the company’s devices and software solutions enable many of the world’s most familiar consumer products with best-of-breed audio and voice capabilities.

In 2018, DSPG licensed SoundChip’s Soundflex® electronic IP to embed in a new family of Smart ANC Codecs that deliver class-leading zero-latency Hybrid ANC performance and a suite of advanced audio features, including Smartaware® – for transparent listening.

DBMC2-TWS

Smart ANC Codec with Framed Adaptive™ sound processing for both insert and loose-fitting style TWS headsets

Product description

The DBMC2-TWS Smart ANC Codec integrates SoundChip’s patented Soundflex technology to deliver authentic, High-resolution, 192 kHz/32 bit audio playback with a suite of advanced features, including Framed Adaptive™ sound processing and Smartaware™ augmented audio. Unlike high-latency digital-only ANC methods, Soundflex technology combines zero-latency, digitally-controlled analog feedback ANC processing with low-latency, high-order digital feed-forward ANC filters to achieve the highest levels of active noise cancelling performance.

To dynamically configure codec settings and filter parameters on-the-fly, the DBMC2-TWS  integrates an ARC EM5D microcontroller (MCU), abundant internal memory and a plethora of digital interfaces, including SPI, I2C, and UART. This suite of powerful internal processing resources enables the deployment of advanced sound processing features, including Framed Adaptive: ANC, Leakage Compensation and Wearer Detection – which allow the headset to autonomously respond to changes in product fit or the ambient sound conditions. Meanwhile, to support beam-forming and other processor-intensive algorithms, on-chip audio and microphone signals can be sample-synchronized and shared externally.

By adopting a highly configurable audio processing architecture and integrating an advanced power management unit (PMU), the DBMC2-TWS provides product integrators with the ability to optimize the performance, power consumption and bill-of-materials of each headset design. In addition, during product use, non-active on-chip processing resources may be selectively disabled in response to changes in use-case, operating mode or power level to reduce power consumption, further extending headset battery life.

Features
  • 01

    Integrated zero-latency feedback & low-latency high-order feed-forward ANC filters

  • 02

    Integrated low-latency high-order talk-through and audio compensation filters

  • 03

    Advanced supervisory SW with support for Framed Adaptive sound processing

  • 04

    Hi-Resolution 192kHz/32-bit audio playback

  • 05

    98.3MHz embedded MCU with DSP extensions and abundant internal memory

  • 06

    Compact 3.7 (l) x 3.7 (l) mm WLCSP-85 package

Benefits
  • 01

    Class-leading Hybrid ANC performance - up to 45dB-peak, 3kHz bandwidth

  • 02

    Natural talk-through with advanced situational awareness

  • 03

    Dynamically responsive to wearer's fitment, use-case and ambient sound conditions

  • 04

    Uncompromising, high definition sound reproduction

  • 05

    Scalable through software and dynamically configurable

  • 06

    Optimised to seamlessly integrate within compact TWS headset form-factor